Intel’s long-awaited answer to AMD’s Ryzen 3rd Gen processors is just around the corner. The 10th generation Comet Lake S processor is expected to be formally announced on April 30 and will feature boost speeds up to 5.3GHz. This speed boost is made possible using Intel’s Thermal Velocity Boost technology, which engages when the system has proper cooling and power available.
The processor is expected to come in three flavors, the top i9-10900K will feature 10 cores and 20 threads as well as reach 5.3GHz. According to leaked specs, the i9-10900K should perform faster than the AMD Ryzen 3700X but slower than the 3900X. The other processors will be the i7-10700K with 8 cores, 16 thread and speeds up to 5.1GHz and the i5-10600K with 6 cores, 12 threads and a top boost speed of 4.8GHz.
Intel says that these processors will have high frames rates in AAA titles, even under heavy multitasking workloads. Pricing for the i9, i7 and i5 are estimated at $550, $288 and $177.
Later this year the two giants go head to head again, with AMD planning the release of the Ryzen 4000 series processors and Intel unveiling their 11th generation processor lineup.
Researchers from the University of Leeds and University of Nottingham have figured out a way to get a data transmission rate of a 100 gigabits per second by control of terahertz quantum cascade lasers. This breakthrough which is 1000 times faster than current fast ethernet operating at 100 megabits per second can be used in a variety of applications. These include large datasets transferred across hospitals, research facilities, or in satellite communications. Read the full article for more information here.
Computer scientists at Intel Labs in collaboration with Texas A&M University have developed an automated way of identifying the source of errors caused by software updates. Their deep learning algorithm is capable of finding performance bugs in hours instead of days.
The traditional way to find the source of errors within the software is to check the status of performance counters within the CPU. These counters are lines of code that gauge how the program is being run in the memory of the computer. By analyzing the counters the programmer can determine if the software is running correctly or if the software’s behavior goes awry.
Toady’s desktops and servers could have hundreds or thousands of performance counters, which makes it impossible to keep track of them manually. This is where the teams deep learning algorithm comes into play, the researchers were able to monitor data coming from a large number of the counters simultaneously by compressing the data. In the compressed format, the algorithm can look for patterns that deviate from the norm.
According to Dr Abdullah Muzahid, assistant professor in the Department of Computer Science and Engineering, the deep learning algorithm can also be used in developing the technology needed for autonomous driving. “The basic idea is once again the same, that is being able to detect an anomalous pattern,” said Muzahid.
Microsoft’s next surface pro might include integrated solar panels. A patent filed with the USPTO shows a surface pro like device cover with at least four integrated solar panels.
Normally solar panels generate electricity from sunlight, however, according to Microsoft, the device can be charged from any artificial light sources. It should also be noted that because of its design, the device can be charged when it’s being used.
At this point, it’s unclear if or when we will see a launching of this device.
Intel may have a surprise for us all at the upcoming 2020 CES show. According to DigiTimes, Intel is planning to release a new cooling solution that can dissipate heat by as much as 30 percent. If true, this will allow computer manufacturers to create extremely thin and light laptops and tablets without fans.
In traditional thermal solutions, thermal modules are placed in a compartment between the keyboard and bottom shell where the key heat-generating components are located. Intel’s new design will use a vapor chamber and attach it with a graphite sheet that is placed behind the screen area for stronger heat dissipation.
Intel’s new cooling design could make 2020 an exciting year for ultra-thin computers. We’ll have to wait and see if all holds true.
Researchers at ETH Zurich have now collaborated with an Israeli scientist to develop a way to store information is almost any object. According to Robert Grass, Professor at the Department of Chemistry and Applied Biosciences this new development allows for 3D printed objects to be integrated with instructions that will last for decades, even centuries.
Many advances have made this new method possible, one of the most important is “Grass”. A method for marking products with a DNA “barcode” embedded in minuscule glass beads. Today a massive amount of data can be stored in DNA. Professor Grass’s colleague Yaniv Erlich, an Israeli computer scientist, developed a method that theoretically makes it possible to store 215,000 terabytes of data in a single gram of DNA. Grass himself was able to store 15 megabytes of data.
The two scientists have combined their research to create a new form of data storage. For there testing the two used a 3-D printed plastic rabbit that contains the instructions for printing the object. Next, the scientist demonstrated the retrieval of the embedded printing instructions contained in the rabbit and printed an exact clone of the original. They did this five times with success.
Future applications for this technology can be used in medical, construction, information technology, and so much more. Right now the biggest hurdle is the price. Translating a 3-D-printing file like the one stored in the plastic rabbit’s DNA costs around $2,050. Just like every other technology, over time the price will come down and the everyday consumer will be able to afford it.
Purdue University engineers have developed a way to make transistors process and store information as one device. For decades many researchers have tried to integrate ferroelectric material and silicon, however, there were always issues with the interface between the two.
A team led by Peide Ye, the Richard J. and Mary Jo Schwartz Professor of Electrical and Computer Engineering at Purdue, discovered how to overcome this issue. They used a material, alpha indium selenide, that not only has ferroelectric properties but also has a narrow band gap which makes it possible to act as a semiconductor without losing ferroelectric properties. Because of this, there are no interface issues.
This new development makes it possible for higher density and more energy-efficient chips. Which translates to more performance per watt. Looking forward, if the storage capacity gets to significant levels we may see computers that don’t have hard drives or RAM. All storage will be integrated into the processor.For more detailed information and to read the full article click here.
Stephen Brewster, a professor of human-computer interaction at the University of Glasgow, UK and his team aim to bring touch, sound, and levitation to videogames in the future with their project called levitate. Their plan involves the use of ultrasound—the same technology used in-car sensors to stop you hitting the wall when parking—to create three different effects. The first is ‘feelable forces’ in mid-air, imitating the feeling of touch without there being a physical object present. The second is what’s known as parametric sound, where a speaker can emit highly focussed audio that is heard just by one person and not, for example, the person sitting next to them. And the third is what gives the project its name: levitation of small objects.
The team is now planning to bring all three aspects together and run them off the same ultrasound speaker system. The sensation of touch comes about when ultrasound waves from different emitters combine at focal points that are moving incredibly quickly, creating the illusion of a solid object in mid-air.
Although this technology is focused on videogames, the technology has other worthwhile applications. Bomb disposal robots could pass the information on to a computer programme that feeds into a wearable haptic device for the person controlling it, for example. Other examples are scientists could sit around a model of a protein floating in mid-air and manipulate it or designers could reach in and make changes to their work in a real 3-D model, not a 2-D computer-simulation of one.
Microsoft’s Project Silica has delivered proof of concept for its quartz glass storage by storing the 1978 movie Superman. Writing to the media is done by etching onto the quartz glass using a femtosecond laser. This new type of storage is highly efficient, can hold data for about 1000 years, and is resistant to heat and weather in general.
FoxGaurd Solutions, Monta Elkins has shown that it’s easy to plant a spy chip on various devices. In his experiment, Elkins took an ATiny85 chip smaller than a pinky fingernail coded the chip and ready it as a spy chip. He then soldered it to a motherboard of a firewall, giving the chip access to the serial port of the firewall.
He used an inconspicuous spot that required no extra wiring, also, this type of modification would not alert an administrator. Elkins said his attack could change firewall settings to offer remote access to the device, disable its security features, and give the hacker access to the device’s log of connections it sees.
What makes this proof-of-concept alarming is how easy it was to do, it’s almost impossible to spot, and how low cost it was (less than $200). With more and more of our lives living online and in the cloud, one has to wonder how secure these service providers and cloud server companies really are.