New Cooling Solution From Intel Could Be A Game Changer For Ultra Thin Computers

Intel may have a surprise for us all at the upcoming 2020 CES show. According to DigiTimes, Intel is planning to release a new cooling solution that can dissipate heat by as much as 30 percent. If true, this will allow computer manufacturers to create extremely thin and light laptops and tablets without fans.

In traditional thermal solutions, thermal modules are placed in a compartment between the keyboard and bottom shell where the key heat-generating components are located. Intel’s new design will use a vapor chamber and attach it with a graphite sheet that is placed behind the screen area for stronger heat dissipation.

Intel’s new cooling design could make 2020 an exciting year for ultra-thin computers. We’ll have to wait and see if all holds true.

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